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Materials and Soldering
Soldering Profile
Flow Soldering (Radial lead type)
Recommended Flow Profile
300
250
200
Peak Flow Temp:260 o C max.
Soldering
150
100
50
Pre-heat Temp:125oC Max
Within 120sec.
Within 10sec.
0
Time (sec)
Reflow Soldering (SMD type)
Reflow profile
Peak temperature
230oC
200(or217)oC
180oC
150oC
B
Preheating
A
PS, PA, HS, HA, SS, SA, SB, FS, SL
VA, VB
Item
Peak Temperature
Preheating
A
B
The number of reflow
Recommended
Condition 1
260 o C or less
150 o C to 180 o C
Within 90 seconds
200 o C and higher
Within 60 seconds
230 o C and higher
Within 40 seconds
Only 1 time
Recommended
Condition 2
250 o C or less
150 o C to 180 o C
Within 90 seconds
200 o C and higher
Within 60 seconds
230 o C and higher
Within 40 seconds
Twice or less
Recommended
Condition 3
260 o C or less
(Within 5 seconds)
150 o C to 180 o C
Within 90 seconds
217 o C and higher
Within 60 seconds
-
Only 1 time
Recommended
Condition 4
250 o C or less
(Within 5 seconds)
150 o C to 180 o C
Within 120 seconds
217 o C and higher
Within 60 seconds
-
Twice or less
NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
47
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